Circuit Board Parameters.
| MAXIMUM USABLE PANEL SIZE: | 14.5"x16.5" (Larger by negotiation) |
| PROCESSES: | Single Sided / D/S PTH / ML up to 12 Layers |
| FINISHES AVAILABLE: | Liquid Photoimageable Soldermask, Black Oxide, SMOBC, Tinned Tracks, Peelable Solder Mask |
| BASE LAMINATE: | FR4 Copperclad |
| AVAILABLE THICKNESS: | 0.6mm, 0.8mm, 1.2mm, 1.6mm, 2.4mm, 3.2mm |
| COPPER THICKNESS: | 1/2oz, 1.0oz, 2.0oz before plating |
| DRILL SIZES: | 0.2mm-6.5mm ranged in 0.05mm increments (holes larger than 6.5mm can be routed) |
| DRILLING TOLERANCES: | +0.1mm/-0 |
| TRACK TO TRACK CLEARANCE: | Minimum .006" |
| ANNULAR RING: | .006" |
| TRACK TO PAD CLEARANCE: | .006" |
| MINIMUM TRACK WIDTH: | .006" |
| GOLD PLATING: | Edge Connector or Full Panel available |
| SERVICES: | 3 Day Prototype (Working Days) 5 Day Prototype (Working Days) 10 Day Production (Working Days) |