| Maximum Usable Panel Size: | 600mmx 700mm (24″ x 27″) |
| Processes: |
Single Sided / Double sided / Multilayer up to 30 Layers |
| Board Thickness: |
0.4 – 4.0mm (0.015″ – .015″) |
| Minimum Hole Size: | 0.20mm (0.008″) |
| Minimum Line Width/Space: | 0.10mm (0.004″) |
| Minimum SMT Space: | 0.20mm (0.008″) |
| Laminate Material: | FR-4, CEM-1, CEM-3, High CTI, Halogen free |
| Plating: | HAL, Flash Gold, Immersion Gold, OSP, Immersion Tin, Immersion Silver |
| Add-ons: | Peelable Soldermast, Carbon Printing, Gold Finger, Counter Sink |
| Technology: | Blind/Buried Via, BGA, Impedance Control |
| Soldermask (LPI): | Green, Black, White, Red, Blue, Yellow |
Parameters