Parameters

Maximum Usable Panel Size: 600mmx 700mm (24″ x 27″)
Processes:

Single Sided / Double sided / Multilayer up to 30 Layers

Board Thickness:

0.4 – 4.0mm (0.015″ – .015″)

Minimum Hole Size: 0.20mm (0.008″)
Minimum Line Width/Space: 0.10mm (0.004″)
Minimum SMT Space: 0.20mm (0.008″)
Laminate Material: FR-4, CEM-1, CEM-3, High CTI, Halogen free
Plating: HAL, Flash Gold, Immersion Gold, OSP, Immersion Tin, Immersion Silver
Add-ons: Peelable Soldermast, Carbon Printing, Gold Finger, Counter Sink
Technology: Blind/Buried Via, BGA, Impedance Control
Soldermask (LPI): Green, Black, White, Red, Blue, Yellow